发明名称 |
Solder paste |
摘要 |
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.
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申请公布号 |
US6926849(B2) |
申请公布日期 |
2005.08.09 |
申请号 |
US20030432844 |
申请日期 |
2003.11.03 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAGUCHI TOSHIHIKO;TAKAURA KUNIHITO;TADOKORO SETSUKO;HIRATA MASAHIKO;YOSHIDA HISAHIKO;NAGASHIMA TAKASHI |
分类号 |
B23K35/02;B23K35/14;B23K35/26;B23K35/36;(IPC1-7):H01B1/02;B23K35/363 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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