| 发明名称 |
Method for manufacturing a light emitting diode device |
| 摘要 |
A light emitting diode device has a body having a recess. The body comprises a pair of half bodies made of metal, an insulation layer provided between the half bodies. An LED is mounted on a bottom of the recess and connected with the half bodies by bumps. The recess is closed by a transparent sealing plate.
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| 申请公布号 |
US6921674(B2) |
申请公布日期 |
2005.07.26 |
| 申请号 |
US20040761320 |
申请日期 |
2004.01.22 |
| 申请人 |
CITIZEN ELECTRONICS CO., LTD. |
发明人 |
HORIUCHI MEGUMI;MICHINO TAKAYOSHI |
| 分类号 |
H01L33/48;H01L33/58;H01L33/60;H01L33/62;H01L33/64;(IPC1-7):H01L21/00 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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