| 摘要 |
A pedestal structure and its fabrication method provide a stress release assembly of micromechanical sensors, in particular acceleration sensors, angular rate sensors, inclination sensors or angular acceleration sensors. At least one silicon seismic mass is used as sensing element. The at least one silicon seismic mass is joined to the silicon frame via at least one elongate assembly pedestal, the surface of which is bonded to a covering wafer, either glass or silicon. Signals may be transmitted via buried conductors in the pedestal. The bonding area is reduced by shallow transversal recesses in the surface of the pedestal. <IMAGE> |
