发明名称 ELECTRONIC ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic element and its manufacturing method with improved applicability, simple manufacturing processes, and capable of performing integration of a higher level. SOLUTION: An electronic element and its manufacturing method are provided, and the electronic element comprises a first substrate, a first lower capacitor provided on the first substrate, a first lower switching element provided on the first lower capacitor, and a second substrate provided on the first lower switching element. The electronic element further has a second lower switching element not connected to the first lower capacitor, and an upper capacitor provided on a second substrate and including a lower electrode connecting to a second lower switching element. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197732(A) 申请公布日期 2005.07.21
申请号 JP20050000178 申请日期 2005.01.04
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 XIANYU WENXU;NOGUCHI TAKASHI;YOO IN-KYEONG;PARK YOUNG-SOO
分类号 H01L21/3205;G11C11/22;H01L21/82;H01L21/8239;H01L21/8246;H01L21/84;H01L27/10;H01L27/105;H01L27/115;H01L27/12;H01L29/786;H01L31/119;(IPC1-7):H01L27/105;H01L21/320 主分类号 H01L21/3205
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