| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel light-emitting-diode package which is simple in its total structure to make the manufacture easy and can effectively dissipate the heat generated from the light-emitting diode. <P>SOLUTION: A high-power light-emitting-diode package to be provided enhances heat dissipation performance, can eliminate wire-bonding process, simplifies the package structure, and decreases the package size. The package includes first and second backside electrodes 43c, 44c, which are connected to at least an electrically conductive via-hole 43b respectively, an insulating film 47 so formed on the upper surface of a lower substrate 41 as to cover at least a heat-dissipating opening 46, first and second electrode patterns 43a, 44a formed on the insulating film 47 and respectively connected to the first and the second backside electrodes 43c, 44c via at least one electrically conductive via-hole 43b and the heat-dissipating opening 46, and a light-emitting diode 45 which is connected to first and second electrode patterns 43a, 44a by flip-chip bonding. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
