发明名称 SURFACE-MOUNTED ELECTRONIC CIRCUIT ARRANGEMENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit arrangement which does not drop when it is mounted on a mother board in a surface-mounted electronic component of a type where a board is exposed. SOLUTION: In the surface-mounted electronic circuit arrangement, a terminal is electrically/mechanically connected to the mother board by soldering. In the surface-mounted electronic circuit arrangement, a circuit board is exposed, a pole fitted to the mother board protrudes from the circuit board and the pole is fixed to the mother board by adhesive. Thus, the surface-mounted electronic circuit arrangement does not drop in a reflow process even if it is mounted on a lower side at the time of soldering the surface-mounted electronic circuit arrangement to the mother board. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197403(A) 申请公布日期 2005.07.21
申请号 JP20040001058 申请日期 2004.01.06
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 YOKOTE NOBUYUKI;TANAKA TOSHIHIKO;FUKUDA KENTARO
分类号 H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K1/18
代理机构 代理人
主权项
地址