发明名称 PRINT-CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide print-circuit boards being miniaturized or thinned and easily attaching and detaching terminals of two boards, and to provide a manufacturing method for the print-circuit boards. <P>SOLUTION: The printed-circuit board 1 has laminated boards formed by laminating boards 3, 4, 5, 6 and 7 having wirings in layers. The printed-circuit board 1 further has a housing 2 having an opening 2a while having a terminal group for the electrical external connections of the wirings through the opening 2a and being formed by a holding by two layers of the boards 4 and 6, together with the boards 5 and 5 held by two layers of the boards 4 and 6 in the laminated boards so that the opening 2a is exposed to the outside. Accordingly, when the opening 2a and the shapes and sizes or the like of terminals for external boards are set previously, the terminals for the external boards are fitted easily only by inserting the terminals into the opening section 2a. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005197344(A) 申请公布日期 2005.07.21
申请号 JP20040000311 申请日期 2004.01.05
申请人 SONY CORP 发明人 ITO SHIGEYASU
分类号 H01R12/06;H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K3/46;H01R12/16 主分类号 H01R12/06
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