| 摘要 |
A method for embedding optical band gap (OBG) devices in a ceramic substrate ( 100 ). The method includes the step ( 320 ) of pre-forming an OBG structure ( 105 ). The OBG structure can be a micro optical electromechanical systems (MOEMS) device. Further, the OBG structure can be preformed from indium phosphide and/or indium gallium arsenide. The method also includes the step ( 325 ) of coating the OBG structure with a surface binding material ( 230 ). The surface binding material can be comprised of calcium and hexane. The ratio of the calcium to hexane can be from about 1% to 2%. At a next step ( 330 ), the OBG structure can be inserted into the ceramic substrate. A pre-fire step ( 335 ) and a sintering step ( 340 ) then can be performed on the substrate.
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