Dual composition ceramic substrate for microelectronic applications

摘要

Ceramic substrates ( 1 ) for microelectronic modules are formed in multiple layers ( 7 & 9 ) fused into a unitary one-piece assembly. The layers contain the same ceramic material but in different purity so that one outer layer ( 9 ) is optimal in composition for bonding to a thick film conductor ( 11 ) and the other outer layer ( 7 ) is optimal in composition for bonding to a thin film conductor ( 13 ). In a dual composition substrate embodiment one layer is formed of a 96% alumina composition and the second layer is formed of a 99.6% alumina composition.