发明名称 SILICON-CONTAINING LAYER DEPOSITION WITH SILICON COMPOUNDS
摘要 Embodiments of the invention generally provide a composition of silicon compounds and methods for using the silicon compounds to deposit a silicon-containing film. The processes employ introducing the silicon compound to a substrate surface and depositing a portion of the silicon compound, the silicon motif, as the silicon-containing film. The ligands are another portion of the silicon compound and are liberated as an in- situ etchant. The in-situ etchants supports the growth of selective silicon epitaxy. Silicon compounds include SiRX6, Si2RX6, Si2RX8, wherein X is independently hydrogen or halogen and R is carbon, silicon or germanium. Silicon compound also include compounds comprising three silicon atoms, fourth atom of carbon, silicon or germanium and atoms of hydrogen or halogen with at least one halogen, as well as, comprising four silicon atoms, fifth atom of carbon, silicon or germanium and atoms of hydrogen or halogen with at least one halogen.
申请公布号 KR20050074965(A) 申请公布日期 2005.07.19
申请号 KR20057006706 申请日期 2003.10.20
申请人 APPLIED MATERIALS INC. 发明人 SINGH KAUSHAL K.;COMITA PAUL B.;SCUDDER LANCE A.;CARLSON DAVID K.
分类号 C01B33/04;C01B33/107;C07F7/08;C07F7/12;C23C16/24;C23C16/30;(IPC1-7):C23C16/24 主分类号 C01B33/04
代理机构 代理人
主权项
地址