| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module capable of preventing an adhesive from squeezing out of a conductor cover for an electromagnetic shield, and preventing the conductor cover from being leanly bonded to a semiconductor device. <P>SOLUTION: An infrared communication module A1 has the semiconductor device 10 in which an LED 2, a photodiode 3, and an IC chip 4 are provided, and the conductor cover 6 for electromagnetic shielding bonded to the semiconductor device 10 via the adhesive 8. On a surface opposite to the adhesive 8 of the conductor cover 6, four projections 6a projecting to the side of the adhesive 8 are formed, and the periphery around the projections 6a is set to be a space 7 for allowing the adhesive 8 to stay. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
