| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which allows the formation of microfabricated interconnections of 20μm or smaller and has superior high-frequency characteristics, and to provide its manufacturing method and an electric device which uses the wiring board. SOLUTION: The wiring board A comprises insulating layers 1, which at least contain organic resin, wiring circuit layers 3 each of which is formed at least on one principal plane of each insulating layer 1, and through conductors 5a which penetrate through each insulation layer 1. The cross-sectional shape of the wiring circuit layers 3 is substantially circular, substantially elliptic, or substantially semi-circular. COPYRIGHT: (C)2005,JPO&NCIPI |
