| 摘要 |
PROBLEM TO BE SOLVED: To provide a suitable probe device having a simple structure used for measuring the electrical property of a semiconductor element and inspecting the hardening depth of a steel material or the like. SOLUTION: A plurality of spheres are respectively embedded at a predetermined interval on an insulation substrate so as to project from the surface of an insulation substrate. The spheres are set to a plurality of contacts to objects to be inspected. As the sphere, for example, a solder ball having a surface on which solder is coated using a conductive material (copper and copper alloy or the like) having low resistance and having a diameter of about 0.3 mm as a core is used. COPYRIGHT: (C)2005,JPO&NCIPI
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