| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip reduced in size, accelerated in velocity and achieved in high concentration, and also reducible in cost, and to provide a manufacturing method therefor, in a semiconductor device formed by laminating a plurality of the semiconductor chips. SOLUTION: The semiconductor chip has a semiconductor substrate, a surface electrode 8 formed on a 1st surface 7 of the semiconductor substrate 1, an insulation part 10 which is formed on the 1st surface 7 except the surface electrode 8 around the side of the semiconductor substrate 1 and on a 2nd surface 9 of the semiconductor substrate 1, and a through hole 5 which is formed in the insulation part 10 around the side of the semiconductor device 1. Further, the chip has conduction patterns 6 formed in the through hole 5 and on the insulation part 10 and the surface electrode 8, and an insulating layer 13 formed by opening a portion of the surface of the conduction pattern 6 on the 1st surface 7 as a 1st external electrode 11 and opening a portion of the surface of the conduction pattern 6 on the 2nd surface 9 as a 2nd external electrode 12. COPYRIGHT: (C)2005,JPO&NCIPI
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