发明名称 Non-volatile SONOS semiconductor memory device and method of manufacturing the same
摘要 A memory device and a method of fabricating the same are provided. The method includes forming a gate stack structure on a semiconductor substrate and partially exposing upper end portions of the semiconductor substrate by etching ends of the gate stack structure, and implanting a dopant into the exposed portions of the semiconductor substrate to form source and drain regions, wherein the gate stack structure is etched such that its width increases from top to bottom. Accordingly, it is possible to manufacture a memory device with high integration, using a simplified manufacture process. <IMAGE>
申请公布号 EP1553619(A1) 申请公布日期 2005.07.13
申请号 EP20040257597 申请日期 2004.12.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SONG, IN-JAE;KIM, WON-JOO;SEO, SUN-AE
分类号 H01L21/8247;H01L21/28;H01L21/336;H01L21/8242;H01L27/115;H01L29/423;H01L29/788;H01L29/792;(IPC1-7):H01L21/28 主分类号 H01L21/8247
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