| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device wherein thermal conduction to a reflection plate can be more effectively and surely performed. <P>SOLUTION: The electronic component packaging device is so structured that a light emitting element 2 is die-bonded to part of a lead frame 1 exposed on the bottom of an opening 10 formed at the top face of a resin package 3, and the reflection plate 5 for emitting light emitted from the light emitting element 2 in prescribed directions is attached to the top face of the resin package 3. Lead terminals 4a and 4b are so installed as to project from two opposite sides of the resin package 3. Of the plurality of lead terminals 4a and 4b, the lead terminal 4a connected to a part to which the light emitting element 2 is die-bonded is bent upward to be soldered to the reflection plate 5 by paste solder 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
