| 摘要 |
PROBLEM TO BE SOLVED: To form a solder layer having a thickness in the range of ten to several tensμm at a predetermined part of a printed wiring board with high productivity without relying upon a conventional method while suppressing variation in thickness. SOLUTION: Using a nozzle head 20 for ejecting molten solder A from a nozzle opening 23, a fixed quantity of molten solder is ejected from the nozzle opening 23 of the nozzle head 20 to a predetermined part of a printed wiring board 50 thus forming a solder layer at the predetermined part of the printed wiring board. COPYRIGHT: (C)2005,JPO&NCIPI |
