发明名称 TREATMENT APPARATUS AND TREATMENT METHOD OF SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a treatment apparatus capable of efficiently performing uniform treatment of a substrate such as removal of organic material. <P>SOLUTION: The treatment apparatus of treating the substrate by using active species produced by plasma is provided with a plasma generator 11 which has a plasma generation part 16 of generating plasma for a nozzle pore 13 and the part opposite to the nozzle pore and is arranged on the upper side of the substrate so as to incline the axial line of the nozzle pore at an angle smaller than 90&deg; for the plate surface of the substrate and a gas supply tube 17 through which a gas is supplied to the plasma generation part of the plasma generator to generate the active species and allows the active species to flow out to the plate surface of the substrate from the nozzle port together with the gas. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005177566(A) 申请公布日期 2005.07.07
申请号 JP20030419345 申请日期 2003.12.17
申请人 SHIBAURA MECHATRONICS CORP 发明人 NISHIBE YUKINOBU;ISO AKINORI;FUKUDA JOJI
分类号 H05H1/24;B08B7/00;H01L21/027;H01L21/304 主分类号 H05H1/24
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