| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus capable of performing film deposition even on a relatively large substrate without increasing the size of a vacuum chamber. SOLUTION: In the vacuum vapor deposition apparatus 15 comprising a filament type evaporation source 2 and a first substrate holder 5 and a second substrate holder 6 to turn the substrate while holding the substrate to be film-deposited, the first substrate holder 5 and the second substrate holder 6 are arranged facing the filament type evaporation source 2 at the side of the longitudinal direction of the filament type evaporation source 2, and the first substrate holder 5 and the second substrate holder 6 are rotated around the center X5 and the center X6, respectively, without revolving the first substrate holder 5 and the second substrate holder 6 when performing the film deposition. COPYRIGHT: (C)2005,JPO&NCIPI
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