METHOD OF MANUFACTURING WAFER SUPPORTER, AND WAFER SUPPORTER MANUFACTURED THEREBY

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer supporter which never sticks to a wafer even in a heat treatment in an oxidizing atmosphere, and to provide the wafer supporter manufactured by the same. SOLUTION: The method of manufacturing the wafer supporter for supporting a wafer during heat treatment of the wafer includes a process of forming the wafer supporter into such a shape that can support a silicon wafer by machining a silicon material, and a process of removing processing damages and a contamination layer introduced into the front surface of the supporter formed by machining by chemical etching. The manufacturing method is improved as follows: the chemical etching is conducted with a mixed acid etching aqueous solution containing hydrofluoric acid, nitric acid, and phosphoric acid; and the processing damages and the contamination layer are removed under control of a surface roughness of a part in contact with the wafer. COPYRIGHT: (C)2005,JPO&NCIPI