发明名称 |
Heat sink formed of diamond-containing composite material with a multilayer coating |
摘要 |
A module serves as a heat sink for semiconductor components. The module includes a diamond/composite substrate that carries a multilayer coating on at least one substrate surface and a housing frame made from ceramics which is soldered onto the substrate. The module excellently fulfills the demands imposed on it, namely a good ability for areally joining to the semiconductor component, a high heat transfer through the joining zone and a good electrical conductivity of the module in the joining zone.
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申请公布号 |
US6914330(B2) |
申请公布日期 |
2005.07.05 |
申请号 |
US20030669073 |
申请日期 |
2003.09.23 |
申请人 |
PLANSEE AKTIENGESELLSCHAFT |
发明人 |
KNERINGER GUENTER;LUEDTKE ARNDT |
分类号 |
H01L23/373;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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