| 发明名称 |
SUBSTRATE JUNCTION, METHOD FOR MANUFACTURING THE SAME, ELECTRIC OPTICAL DEVICE, ELECTRONIC EQUIPMENT AND BUMP ELECTRODE STRUCTURE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture an electrically stable substrate junction without generating any electric failure such as short-circuit. <P>SOLUTION: A bump electrode 25a including elastic particles 27 is formed with at least one of an electronic element 24 and wiring 22. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005175170(A) |
申请公布日期 |
2005.06.30 |
| 申请号 |
JP20030412374 |
申请日期 |
2003.12.10 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
YODA TAKESHI |
| 分类号 |
H01L51/50;G09F9/00;G09F9/30;H01L21/60;H05B33/14;H05B33/26 |
主分类号 |
H01L51/50 |
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