摘要 |
<p>An image sensor is disclosed, in which a light shielding layer is positioned in a circumference of a microlens array, and the light shielding layer has a thickness greater than that of the microlens array, to prevent a contaminant blocking sealing tape from directly contacting the microlens array and support the sealing tape, thereby avoiding damage to the microlens array when pressure is applied to press the sealing tape and/or polish a back surface of a semiconductor substrate. If such damage is prevented, the light converging function of the microlens array may be optimized, and the quality of the image reproduced by the image sensor can also be improved, substantially.</p> |