| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic circuit substrate which can reduce burning strain smaller while preventing problems of stamping unnecessary ruggedness on a front layer conductor or a passive element, causing a foreign matter adhesion, or decreasing a plating property and solder wettability in the method of manufacturing the ceramic circuit substrate by a simultaneous burning step using a restricted sheet. <P>SOLUTION: In the method of manufacturing the ceramic circuit substrate, an element sheet 21 integrated by simultaneous burning is laminated on an unburned laminate 20 to obtain an unburned circuit substrate 30. Thereafter, the restricted sheets 24, 24 not sintered at the burning temperature of the unburned circuit substrate 30 are laminated, and the unburned circuit substrate 30 is restricted by the restricted sheets 24, 24. The unburned circuit substrate 30 is burned at the temperature of a range that the restricted sheets 24, 24 are not sintered to obtain the ceramic circuit substrate 32. The restricted sheets 24, 24 and the ceramic coating layer 35 coating a thick film resistor 7 are removed to form an overcoating layer 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
