| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a low content of a conductor component in a manufacturing method for a multilayered wiring board using ultrafine metallic particles (nanoparticles) capable of sintering at a low temperature, and to solve the problem of wiring reliability caused by the low content of the conductor component. SOLUTION: By extruding the paste of a composite 6 for forming wiring conductor through a screen-printing mask, the pattern of a wiring precursor is directly drawn on a substrate. The composite consists of (a) ultrafine metallic particles (metallic nanoparticles) with an average particle size of 1-10 mm, (b) a coated organic compound coated with a thickness of 1-10 nm on the surfaces of the ultrafine metallic particles, (c) an organic compound with latent reactivity, reacting with the coated organic compound in a range of 100-150°C, (d) metal particles with an average particle size of 0.5-10μm, (e) the paste of a wiring conductor forming composite 6 including a dispersion solvent capable of stably dispersing the components of the items of (a) to (d). The pattern is sintered by heating at 100 to 250°C, and then is electrochemically treated so that desired conductor cross section is set and a conductor is deposited inside a wiring conductor. COPYRIGHT: (C)2005,JPO&NCIPI |
