| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device wherein a semiconductor light emitting element of flip chip is sealed equally with resin, and to provide its manufacturing method. <P>SOLUTION: The semiconductor light emitting device is provided with a substrate 11 wherein a recessed part 12 is formed on a main surface, a through hole 15 for letting ant air which is formed on a part of a bottom surface of the recessed part 12 and penetrates to a surface opposite to the main surface, a first wiring part 16 formed on the other part of the bottom surface of the recessed part 12, a second wiring part 17 which is formed on a part of a surface opposite to a main surface of the substrate 11, a penetrating wiring part 18 for connecting the first wiring part 16 and the second wiring part 17, the semiconductor light emitting element 13 which is fixed on the first wiring part 16 so as to stride the pierced hole 15 and electrically connected to the wiring part 16, and resin 14 for sealing the semiconductor light emitting element 13. Air in the recessed part 12 is exhausted from a through hole 15 side, and press fit and charge of liquid resin 43 contained in a resin tub 44 is performed into the recessed part 12 and the through hole 15 by differential pressure with atmospheric pressure. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
