Semiconductor chip mounting method where the sawing tracks are used to determine an actual position each time the distance between the chip to be mounted on the carrier foil and the last exceeds a given value

摘要

Semiconductor chips (3) are presented on a carrier foil (20). Unusable chips are marked with data concerning their usability and quality which is stored in a wafermap. When the distance between the next and the last chip to be mounted (3b) exceeds a predetermined value, automatic assembly equipment determines the actual position based on sawing tracks (4) left in the foil. If this differs from the set position, this is taken into account when approaching the next chip.