发明名称 HEAT CONDUCTION DEVICE
摘要 <p>A heat conduction device is fixed into a radiator (2) and abutted a heat-generating component (42). This radiator (2) has a through-hole (10). The heat conduction device includes a column body (1). One end of the column body (1) is recessed to form a hollow part in order to increase the radiating surface; the other end of the column body (1) is a contact surface (12). The outer surface of the column body (1) is fixed inside the through-hole (10) of the radiator (2), the contact surface (12) is abutted the heat generating component (42); Due to the formation of the hollow part, the radiating surface is increased, the radiating effect is enhanced, and the cost can be decreased greatly due to the simple configuration of the column body (1).</p>
申请公布号 WO2005059465(A1) 申请公布日期 2005.06.30
申请号 WO2004US41677 申请日期 2004.12.10
申请人 MOLEX INCORPORATED;HU, JUN-LIANG 发明人 HU, JUN-LIANG
分类号 F28F1/12;H01L23/367;H01L23/40;H01L23/467;(IPC1-7):F28F1/12 主分类号 F28F1/12
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