发明名称 LOW POWER SEMICONDUCTOR CHIP HAVING SEPARATED POWER RING AND MANUFACTURE AND CONTROL METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a low power semiconductor chip having a separated power ring. <P>SOLUTION: A lower power semiconductor chip includes an electrode pad to which a power is supplied from the outside, a plurality of pad groups grouped by function so as to include at least an input/output pad, a separated power ring so as to connect a power source supplied from the electrode pad to each of the plurality of pad groups, and a switch control part for executing on/off control individually for the pad groups by determining the presence/absence of the use of the input/output pad of the pad group. The pad groups include a pad having the power source in common, which is supplied from one electrode pad. The switch control part determines the presence/absence of the use of each of the plurality of the pad groups, and as a result of the determination, the input/output pad of the pad group not used is turned off. This realizes a reduction of a power consumption by a static current of a semiconductor integrated circuit, by turning on/off a digital pad power source depending on the presence/absence of the use. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005175489(A) 申请公布日期 2005.06.30
申请号 JP20040356040 申请日期 2004.12.08
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE JONG-RIM;IM JUNE-HYEOK;KIM DONG-YUN
分类号 H01L21/822;G06F1/32;H01L21/82;H01L23/48;H01L23/495;H01L23/528;H01L27/04 主分类号 H01L21/822
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