| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that filling of conductive paste for forming via-hole conductors becomes more difficult as the height of the via-hole conductors increases, and a drop-out of the conductive paste in via-holes after filling them with the conductive paste becomes more likely as the section of the via-hole conductors increase when the via-hole conductors penetrating a plurality of ceramic layers are different from each other in height when the ceramic layers are different from each other in thickness as the ceramic layers compose a laminated body of multilayer ceramic electronic components. <P>SOLUTION: The section of the via-hole conductors 38, 39, 44, 45, which penetrate the thicker ceramic layers 32, 35, is made larger than that of the via-hole conductors 40 to 43, which penetrate the thinner ceramic layers 33, 34. The thinner ceramic layers 33, 34 are provided with a capacitor and are arranged inside the laminated body 37. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
