Semiconductor device, manufacturing method thereof and electronic equipment

摘要

The invention relates to providing a semiconductor device in which a connecting terminal of a chip is prevented from being come off from a land of a circuit board. A semiconductor device includes a substrate 3 on which a plurality of first terminals 31 are formed and a chip 2 having a second terminal 21 electrically coupled to astride at least two first terminals 31 out of the plurality of the first terminals 31.