发明名称 Substrate and method of forming substrate for fluid ejection device
摘要 A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced stops in the first side of the substrate, partially forming a first portion of the opening in the substrate from the second side by a first process, further forming the first portion of the opening in the substrate from the second side by a second process, including forming the first portion of the opening to the spaced stops, and forming a second portion of the opening in the substrate from the first side, including forming the second portion of the opening between the spaced stops.
申请公布号 US6910758(B2) 申请公布日期 2005.06.28
申请号 US20030619639 申请日期 2003.07.15
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 TRUNINGER MARTHA A.;LEITH STEVEN DAVID;HESS JEFFERY S.
分类号 B41J2/16;(IPC1-7):B41J2/16 主分类号 B41J2/16
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