| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small-sized memory card increasing its reliability and use-life and being convenient for a manufacture. <P>SOLUTION: The memory card has a first substrate 20, a heatsink, a second substrate 24, at least a piece of upper-layer memory chip 26, at least a piece of lower-layer memory chip 28, and a sealing resin layer 30. A plurality of through-holes are formed to the first substrate 20 and the second substrate 24, and the insides of a plurality of the through-holes are filled with a metal. The heatsink is installed between the first substrate 20 and the second substrate 24, and brought into contact with the metal in a plurality of the through-holes. The upper-layer memory chip 26 and the lower-layer memory chip 28 are mounted on the first substrate 20 and the second substrate 24, respectively. The amount of heat of the lower-layer memory chip 28 is transmitted to the heatsink through the metal in a plurality of the through-holes, and the amount of heat is dissipated by the heatsink. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
