| 摘要 |
PROBLEM TO BE SOLVED: To relieve an array pitch between external terminals and to improve high reliability in a semiconductor device having a fan out structure. SOLUTION: When a plurality of semiconductor chips 14 having first main surfaces 14b where electrode pads 21 are formed, and second main surfaces 14c confronted with the first main surfaces are loaded on chip loading faces 12a whose areas are larger than the second main surfaces of a wafer-like loading substrate 12 at prescribed intervals; first and second grooves (18a and 18b) formed on the chip loading faces are made as target lines and they are loaded along the grooves. Solder balls 25 which are electrically connected to the electrode pads of the semiconductor chips are arranged on wiring patterns 34 extending from a first region 100 positioned above the semiconductor chip in a surface region of a sealing layer 32 covering the semiconductor chips to a second region 200 surrounding the first region. The sealing layer and the loading substrate are cut and are made into pieces. Thus, the semiconductor device of the fan out structure can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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