发明名称 INSULATING FILM, METHOD FOR FORMING SAME AND COMPOSITION FOR FORMING FILM
摘要 <p>Disclosed is a method for forming an insulating film which has excellent resistance to processing such as etching, ashing or wet-cleaning while maintaining a low relative dielectric constant of a polysiloxane insulating film. A polysiloxane insulating film is formed on a base through hydrolysis-condensation of a silane compound. Then a solution obtained by dissolving a polycarbosilane compound represented by the general formula below in a solvent is applied to the polysiloxane insulating film and the thus-applied coating is heated to form a polycarbosilane insulating film. Following that, a CVD insulating film is formed on the polycarbosilane insulating film by plasma CVD.</p>
申请公布号 WO2005057646(A1) 申请公布日期 2005.06.23
申请号 WO2004JP18311 申请日期 2004.12.08
申请人 JSR CORPORATION;SHIOTA, ATSUSHI 发明人 SHIOTA, ATSUSHI
分类号 C09D183/16;H01L21/312;H01L21/316;H01L21/768;(IPC1-7):H01L21/312 主分类号 C09D183/16
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