发明名称 |
INSULATING FILM, METHOD FOR FORMING SAME AND COMPOSITION FOR FORMING FILM |
摘要 |
<p>Disclosed is a method for forming an insulating film which has excellent resistance to processing such as etching, ashing or wet-cleaning while maintaining a low relative dielectric constant of a polysiloxane insulating film. A polysiloxane insulating film is formed on a base through hydrolysis-condensation of a silane compound. Then a solution obtained by dissolving a polycarbosilane compound represented by the general formula below in a solvent is applied to the polysiloxane insulating film and the thus-applied coating is heated to form a polycarbosilane insulating film. Following that, a CVD insulating film is formed on the polycarbosilane insulating film by plasma CVD.</p> |
申请公布号 |
WO2005057646(A1) |
申请公布日期 |
2005.06.23 |
申请号 |
WO2004JP18311 |
申请日期 |
2004.12.08 |
申请人 |
JSR CORPORATION;SHIOTA, ATSUSHI |
发明人 |
SHIOTA, ATSUSHI |
分类号 |
C09D183/16;H01L21/312;H01L21/316;H01L21/768;(IPC1-7):H01L21/312 |
主分类号 |
C09D183/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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