| 摘要 |
The present invention provides an adhesive composition comprising a main adhesive composed of 50 to 100% by weight of BPA epoxy resin, 0.5 to 5% by weight of a dispersant and 0.5 to 5% by weight of a fluidity adjusting agent as additives, and 0 to 50% by weight of a filler; and a curing agent composed of 15 to 50% by weight of polymeric amine, 1 to 99% by weight of amine-terminated reactive rubber and 0.5 to 5% by weight of an anti-settling agent as additives, 0.1 to 10% by weight of tertiary amine as a catalyst, and 0 to 60% by weight of a filler. The main adhesive component and the curing agent component are mixed in a ratio of 1:2 to 2:1 by weight. The adhesive comprising the adhesive composition of the present invention has superior adhesive force and peeling strength and thus exhibits very excellent adhesiveness in bonding an SMC board to PVC material or wood.
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