| 摘要 |
<P>PROBLEM TO BE SOLVED: To automatically separate and recover an IC tag inlet from a recovered slip piece with the IC tag inlet, recovered after use of a slip, to thereby carry out recovery and reuse of the used IC tag inlet at a low cost. <P>SOLUTION: There is provided a method of separating and recovering the IC tag inlet from the recovered slip piece with the IC tag inlet, which is formed at least of the recovered slip piece, a thermal-peeling adhesive layer arranged on one surface of the recovered slip piece, and the IC tag inlet held on a front surface of the recovered slip piece by means of the thermal-peeling adhesive layer. The method is comprised of the two steps. In the first step (a), the recovered slip pieces each with the IC tag inlet are introduced into a separating container, and the slip pieces are agitated under heating, to thereby separate the IC tag inlets, the recovered slip pieces, and remnants of the heat-peeling type adhesive from each other. In the second step (b), the IC tag inlets, the recovered slip pieces, and the remnants of the heat-pealing adhesive which are separated from each other are taken away from the separating container, and the IC tag inlets are sorted and recovered. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
