| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-chip type semiconductor device, wherein a space is provided in the chip back surface to enable the electrode pads hidden beneath a chip to be wire bonded. <P>SOLUTION: A first semiconductor chip 10 is fixed onto a film, and a second semiconductor chip 11 is fixed onto the first semiconductor chip 10. The first semiconductor chip 10 is connected to a lead terminal 41 through a first bonding wire 16a, and the second semiconductor chip 11 is connected to the lead terminal 41 through a second bonding wire 16b. The first and second semiconductor chips 10, 11 have mutually resembling sizes and shapes, and a first electrode pad is hidden by the second semiconductor chip 11 in plan view. The space is provided at a lower part of the end of the semiconductor chip 11, and the space is utilized to connect the first electrode pad to the second bonding wire. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
