| 摘要 |
PROBLEM TO BE SOLVED: To realize repairing of the disconnected part of the wiring of an electronic circuit substrate by bringing the disconnected part of the wiring into coincidence with the size and the shape of the wiring into coincidence accurately. SOLUTION: A method of repairing the wiring for connecting the disconnected part of the wiring includes a step of applying a masking reagent 16 over a region larger than the disconnected part 15c of the wiring part 15a of the wiring 15 formed on the electronic circuit substrate (work) W as seen in plane and irradiating with a laser beam L, a step of removing the masking reagent 16 of the wiring region 17 including the disconnected part 15c, then a step of coating the wiring region 17 from which the masking reagent 16 is removed with a metal colloid, etc. 19, a step of depositing the metal thin film 20 by irradiating the metal colloid, etc. 19 with the laser beam L to heat the metal colloid, etc. 19, and a step of connecting the disconnected part 15c. COPYRIGHT: (C)2005,JPO&NCIPI
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