METHOD OF DIFFERENTIALLY PATTERNING LAYERS OF ORGANIC THIN FILM MATERIAL WITHOUT DAMAGING UNDERLYING LAYERS

摘要

The present invention is a method of differentially patterning layers organic thin film material without damaging underlying layers. More specifically, the invention is a method of patterning layers of organic thin film material such as OLEDs without damaging underlying layers by using an ultra-fast laser programmed with the appropriate wavelength (lambda), pulse width (tau), spectral width (Deltalambda), spot size, repetition rate, bite size and power, all derived from examining each layer's absorption spectra, thermal, and chemical characteristics. The method of the present invention includes the steps of measuring each layer's absorption spectrum, examining each layer's thermal and chemical characteristics, determining if the layer ablatable, determining the laser setup, patterning the layer through laser ablation processing and determining if more layers need to be ablated.