POLYIMIDE FILM, METHOD FOR PRODUCING THE SAME, AND BASE BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film excellent in filler dispersibility, mechanical properties and electrical insulation reliability, to provide a method for producing the film, and to provide a base board using the polyimide film. SOLUTION: The polyimide film is a product obtained by polycondensation between an aromatic diamine having a benzoxazole structure and an aromatic tetracarboxylic acid anhydride. This polyimide film also contains a thermally conductive filler. The base board for printed wiring boards is such that at least one side of the polyimide film is laminated with metallic layer(s). COPYRIGHT: (C)2005,JPO&NCIPI