| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic electronic chip component wherein the bonding strength of wire bonding can be enhanced. SOLUTION: In a laminated inductor chip wherein external electrodes 6a, 6b are formed to both end faces of a ferrite element body 2, the film thickness of Au coating films 5a, 5b of the outermost layer of the external electrodes 6a, 6b is selected to be at least 0.6μm or over and also the average surface roughness Ra of the external electrodes 6a, 6b is suppressed to be 0.4μm or below. The laminated inductor is manufactured by coating conductive paste containing Ag powder 95 wt.% or over (preferably 100 wt.%) of which comprises nearly spherical powder to both the end faces of the ferrite element body 2 and baking the conductive paste to form a background electrode, and thereafter applying electrolytic Ni plating and electrolytic Au plating to the background electrode to form Ni coating films 4a, 4b and Au coating films 5a, 5b. COPYRIGHT: (C)2005,JPO&NCIPI
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