EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which forms a hardened resin layer quickly hardened in a pressure welding process and having an excellent voidless adhesiveness and results in an improved efficiency for the production of semiconductor devices by flip chip mounting. SOLUTION: The invention relates to an epoxy resin and an epoxy resin composition which contains a hardener and is liquid at room temperature. A product of the addition reaction of 2-methylimidazole as the hardener with a naphthalene ring-containing diglycidyl ether expressed by chemical formula (1) is used. Semiconductor devices with high operational reliability are efficiently produced by mounting flip chips using the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI