SEMICONDUCTOR MODULE PROVIDED WITH CONTACTS EXTENDING THROUGH THE HOUSING

摘要

The invention relates to a semiconductor module (10) comprising a housing (52) made of a plastic material (43) and contacts extending (44) from a lower side of the housing (45) to an upper side of the housing (46). Said housing (52) is made of at least two plastic layers (9) and (19). The first plastic layer (9) comprises external contacts (48) and contacts (50) extending through said layer. A rewiring structure (4) supports the second plastic layer (19), which surrounds the semi-conductor chips (3) and (5) the inside of the plastic material (43). The contacts extending through the housing (44) are arranged in the edge area of the semi conductor module (10).