WIRING SUBSTRATE COATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring substrate coating method for forming an etching resist layer of a specified pattern by immersing a wiring substrate having a through-hole and via in a photosensitive resist liquid and lifting it to cover the whole surface of an insulation substrate including the inner wall face of the through-hole and via.

SOLUTION: The immersion coating method for coating the wiring substrate having the through hole and comprises the steps of immersing the insulation substrate having metal conductor layers formed on the inner wall face of the through-hole and the two faces of the substrate and lifting it. The lifting speed is 1-8 mm/s.

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