| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder fill, the manufacturing method of the same, and the mounting method of a printing circuit substrate of a semiconductor chip utilizing the solder fill. <P>SOLUTION: A flip chip is mounted by a method wherein the semiconductor chip, the solder fill and the printing circuit substrate are arrayed well under a condition that the solder fill is adhered onto the semiconductor chip previously or the solder fill is adhered onto the printing circuit substrate previously to make them integrated type and, thereafter, the semiconductor chip and the printing circuit substrate are connected mutually through a reflow process. The solder fill is the compound material having an underfill material, used as a filling material between the semiconductor chip and the substrate in a semiconductor package manufacturing process, and a solder bump material made so as to have a column shape in the underfill material and coincide with the pad configuration of the semiconductor chip while having the same height as the underfill material. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
