发明名称 THIN-FILM CAPACITOR, HIGH-DENSITY MOUNTING BOARD WITH BUILT-IN THIN-FILM CAPACITOR, AND METHOD OF MANUFACTURING THIN-FILM CAPACITOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thin-film capacitor which can be built in a board without damaging electrical characteristics or dimensional characteristics of a high-density mounting board and which has sufficient capacitance, and to provide a high-density mounting board with the built-in thin-film capacitor, and a method of manufacturing the thin-film capacitor. <P>SOLUTION: The thin-film capacitor comprises at least a high-dielectric-constant dielectric layer, and an upper electrode layer and a lower electrode layer which interpose the dielectric layer from the upper and the lower, wherein contact parts of the upper and the lower electrodes are drawn out on an upper level of the upper electrode. The thin-film capacitor having a structure with a film thickness between 200 nm and 50 nm of the high-dielectric-constant dielectric layer is manufactured, and is used as a built-in passive component of a semiconductor wiring board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005159259(A) 申请公布日期 2005.06.16
申请号 JP20040052400 申请日期 2004.02.26
申请人 UNIV WASEDA;OKI ELECTRIC IND CO LTD;TOKYO OHKA KOGYO CO LTD 发明人 AISAKA TETSUYA;KOIWA ICHIRO;HASHIMOTO AKIRA;SATO YOSHIMI
分类号 H01G4/12;H01G2/00;H01G4/008;H01G4/06;H01G4/30;H01G4/33;H01G13/00;H01G13/06;H01L21/822;H01L27/04;H05K1/16;H05K3/38;H05K3/46;(IPC1-7):H01G4/12 主分类号 H01G4/12
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