| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device housing package where a temperature rise in the semiconductor device is suppressed by efficiently discharging heat generated in the semiconductor device to the outside, which allows the semiconductor device operate normally and stably for a long period of time, and causes no crack in a ceramics frame, and the semiconductor equipment thereof. <P>SOLUTION: The semiconductor device housing package has a long plate metal substrate 1 with a convex area 1a formed at the upper main area where the semiconductor device 3 is mounted and a ceramics frame 2 that has a wiring conductor 2a for conducting the inside and outside and has been brazed enclosing the convex area 1a at the upper main area of the substrate 1. Wherein, the thickness of the surrounding of the convex area 1a of the substrate 1 is 0.1 to 0.3 mm and a clearance with a length of 3/100 to 20/100 of the long side length of the convex area 1a is formed between the side of the convex area 1a and the inside of the frame 2 in the both short sides of the substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
