SUBSTRATE POSITIONING SYSTEM

摘要

A substrate positioning system for preventing dust or the like from depositing on a substrate such as a wafer used for semiconductor fabricating and accurately adjusting the direction of a substrate in a short time. Wafer center positioning is performed by using a plurality of rollers (220) that press the peripheral edge of a wafer (W) from many directions in this substrate processing system (A), a suitable embodiment. The contact (211) of a contact member (210) is brought into contact with the notch (Wa) of the wafer (W) while the center positioning condition by the rollers (220) is maintained, and the contact member (210) is moved in an arc shape to turn the wafer (W) and adjust its direction.