COMPOSITION OF FLUX FOR SOLDERING, SOLDERING PASTE, AND SOLDERING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a flux for soldering and a paste of high reliability which do not impair soldering property, reduce the occurrence of cracking and deterioration in the flux residues remaining on a printed circuit board even when the flux residues are subjected to a temperature change after soldering, and which do not give rise to an insulation defect and migration even under a high-temperature and high-humidity environment. SOLUTION: The flux composition for soldering containing compound with one or more carboxylic groups and oxcetane groups which are made latent in one molecule and the paste compounded with the same resin and solder powder are provided. COPYRIGHT: (C)2005,JPO&NCIPI